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Multi-component materials for manufacturing of film elements BIC and targets from them
Description
Appointment: manufacturing of film current–carrying and resistive elements of integrated microcircuits by a method magnetron dispersions.[br][/br]Field of application: microelectronics.[br][/br]Manufacturing method: gas-plasma sputtering, pressing and sintering, moulding,[br][/br]machining.[br][/br]Overall dimensions: Ø (46–225) x (6–24) mm;[br][/br]114 x 264 x (2–15) mm;[br][/br]Advantages - factor of stability of electric properties of thin films is no more than 0,01;[br][/br]specific resistance of resistive films – 0,5–1,5 kΩ/, TKR of resistive films 1–10(-4)/K.
Technology Type
Design
Material
Technology Differentiation and Uniqueness
New material, New design
Technological Keywords
Multi-component materials, manufacturing, film elements, BIC, targets
Development Stage
Prototype (demonstration available for testing)
Results of demonstration test available
Currently in use/production
Intellectual Property Rights
Secret Know-How
Range of Applications
Microelectronics
Classifier Used at the Enterprise Europe Network
Automotive, Transport and Logistics
Chemicals
Environment
Intelligent Energy
Maritime Industry and Services
Materials
Nano- and Microtechnologies
Space and Aerospace
Classifier Used at the Technology Transfer Network of yet2.com Inc.
Aerospace
Automotive
Chemistry
Electronics
Environmental
Instrumentation
Manufacturing
Materials
Physics
Techniques
Preferable Regions
North America
South America
Europe
Asia
Africa
Australia
Environmental Impact
No
Type of Collaboration Sought
R&D Contract
License
For Sale
Terms&Restrictions
No
Available Technical Assistance
Documentation
Personnel
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